Flexible PCB Supplier & Manufacturer

WellPCB manufactures flex PCBs with layer counts from 1 to 6, with ultimate builds extending to 10 layers for specialized multi-layer flex circuits.

Fabrication uses polyimide base materials such as Shengyi SF305, Songxia RF-775, and Taihong PI, supporting dielectric stability, thermal resistance, and fine-line processing.

Production tolerances include a minimum 3 mil trace/space, 0.1 mm laser drill, and 0.15 mm mechanical drill, with pad-to-pad clearance down to 4 mils (3 mils in high-density designs).

Finished board thickness ranges from 0.05 mm to 0.5 mm (up to 0.8 mm for advanced builds), with finger width tolerance ≥0.1 mm (≥0.05 mm for precision contacts).

We integrate FR4 stiffeners from 0.075 to 3.2 mm and polyimide stiffeners from 0.025 to 0.225 mm, with adhesive widths controlled to 1.5 ± 0.5 mm and minimum copper clearance of 0.3 mm.

On high-cycle flex designs, these are commonly used for ZIF connectors, edge contacts, and mechanical reinforcement zones.

Stiffener design and placement follow IPC-2223 guidelines for mechanical reinforcement and pad stability in dynamic flex zones.

We offer ENIG, Lead-Free HASL, OSP, Immersion Tin, and Immersion Silver finishes for all flex PCB builds. Surface treatments are applied to exposed copper for solderability, oxidation resistance, and electrical contact durability.

ENIG is preferred for high-density designs and gold finger edge connections; OSP is ideal for prototype runs and flat SMT pads. Selective finish combinations such as ENIG + OSP are available for mixed-performance zones.

Peelable mask can be combined with coverlay for selective solder areas, ZIF connectors, or rework zones. All finishes conform to IPC-455x series standards for surface coatings and meet RoHS-compliant lead-free assembly requirements.

All flexible printed circuit boards can be manufactured with impedance control:

• •Single-ended: ± 5 Ω (≤50 Ω), ±10% (>50 Ω)
• •Advanced builds: ± 3 Ω (≤50 Ω), ±8% (>50 Ω)

These tolerances (as precise as ±3 Ω) are validated through TDR testing and reflect industry-leading control for RF, sensor, and high-speed signal designs. For controlled impedance in RF, medical, and sensor applications.

All flex PCBs undergo AOI, Flying Probe, ICT, and FCT to ensure circuit continuity and electrical performance.

Structural reliability is validated through X-ray inspection, micro-section analysis, peel strength testing, and thermal shock simulation.

We also perform impedance testing on controlled line widths to confirm ±3 Ω or ±5% targets for matched-line designs.

WellPCB provides full flex PCB assembly, including SMT, through-hole, and mixed technology builds.

We support BGA (down to 0.2 mm pitch), QFP (0.15 mm), and fine-pitch component placement with ±30 μm accuracy at CPK ≥1.

Assembly capabilities include conformal coating, box builds, and component sourcing from Mouser, Digi-Key, Arrow, and Avnet. Board sizes range from 50 × 50 mm to 610 × 508 mm.

We manufacture RF, coaxial, ribbon, overmolded, and waterproof cable assemblies for flex integration.

Custom wire harnesses are available for automotive, medical, aerospace, and robotic applications.

All cable assemblies are thoroughly tested and can be delivered as part of complete electromechanical builds or standalone units.