Flexible Printed Circuit Boards

Definition:

Flexible Printed Circuit (FPC),it is a kind of highly reliable and excellent flexible pcb made of polyimide or polyester film. It has the characteristics of high wiring density, light, thin and good bending.

 

Production process:

Double-Sided PCB

Cutting → Drill Hole → PTH → Electroplate → Pre-Processing → Dry Film → Check Position → Exposure → Development → Graphic Electroplating → Etching → Decoating → Surface Processing → Cover the film → Press → Solidification → Immersion Nickel → Printing character → Shear → Electrical Measurement → Punching → Final inspection → Packing → Shipment

Single Panel

Cutting → Drill Hole → Dry Film → Check Position → Exposure → Development → Etching → Decoating  → Surface Processing → Cover the film → Press → Solidification → Immersion Nickel → Printing character → Shear → Electrical Measurement → Punching → Final inspection → Packing → Shipment

 

Characteristic:

1.Short Assembly Time: All lines are configured. Save the connection of redundant cables.

2.Small Volume: Effectively reduce the volume and increase the convenience of carrying.

3. More Light: The weight of the final product can be reduced.

4.More Thin:Increase Softness,Strengthen the assembly of three dimensional space in a limited space.

 

Application:

Mobile phone

The thinner and lighter FPC can effectively save the volume of product,which can connect the battery,microphone and buttons easily.

Computer and LCD screen

The Integrated Line configuration of FPC and the thickness can turn digital signals into pictures, rendered via LCD screen.

CD Walkman

The characteristics of Three dimensional assembly of FPC make the huge CD as companion to carry.

 

Latest Applications:

HDD(hard disk drive) and xe encapsulation component elements.The wireless charging coil array concentrates the electromagnetic field in a certain area to reduce the space transfer consumption, thereby improving the power conversion efficiency.

 

Prospect:

FPC In the future, we should continue to innovate from four aspects as follows:

1, The thickness of FPC must be more flexible, must be thinner.

2, Folding resistance. Bending is the inherent property of FPC. This character must be stronger in the future. Of course, this requires better substrates.

3, The price. At this stage, the price of FPC is much higher than that of PCB. If the price of FPC comes down, the market will definitely be a lot wider.

4, The process level. In order to meet various requirements, FPC process must be upgraded, minimum aperture, minimum line width and spacing must reach higher requirements.