wellpcb

PCB Assembly Capabilities

WellPCB Assembly Capability

 

 • RoHS compliant and lead-free process ISO9001, Factory audit by Intertek.

 • Small quantities and quick turns available.

 • Single or double-sided mixed technology PCB assembly.

 • Capability to handle virtually any device including all types of BGAs, CGAs, QFNs, DFNs, CSPs and SONs.

 • BGA and Micro-BGA installation and rework with 100% X-Ray Inspection, Automated Optical Inspection.

 • SMT, Through Hole assembly, Single/double side SMT, Single/double sides mixture assembly.

 • Accuracy: <±40μm, under the condition of 3σ,CPK≥1., Angle accuracy <±0.06°.

 • Minimum width/space of QFP: 0.15mm/0.3mm, Minimum diameter /space of BGA: 0.2mm/0.35mm.

 • PCB Size:50mm×50mm~450mm×406mm, PCB Thickness:0.5mm~4.5mm.

 • Placer speed:60,000 chips per hour, Feeders number: 140 piece of 8 mm reel feeders,28 IC tray feeders.

 • Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micor metallographic section analysis, etc.

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We are here to serve the customers.We aim to make the experience better than anything you have had before. That way we know we are confident you will keep coming back. We constantly strive towards a never ending cycle of improvement and this means constant change to meet the changing demands of the market.