• RoHS compliant and lead-free process ISO9001, Factory audit by Intertek.
• Small quantities and quick turns available.
• Single or double-sided mixed technology PCB assembly.
• Capability to handle virtually any device including all types of BGAs, CGAs, QFNs, DFNs, CSPs and SONs.
• BGA and Micro-BGA installation and rework with 100% X-Ray Inspection, Automated Optical Inspection.
• SMT, Through Hole assembly, Single/double side SMT, Single/double sides mixture assembly.
• Accuracy: <±40μm, under the condition of 3σ，CPK≥1., Angle accuracy <±0.06°.
• Minimum width/space of QFP: 0.15mm/0.3mm, Minimum diameter /space of BGA: 0.2mm/0.35mm.
• PCB Size：50mm×50mm～450mm×406mm, PCB Thickness：0.5mm～4.5mm.
• Placer speed:60,000 chips per hour, Feeders number: 140 piece of 8 mm reel feeders，28 IC tray feeders.
• Reliability Test: flying probe test/fixture test, impedance test, solderability test, thermal shock test, hole resistance test, and micor metallographic section analysis, etc.