SMT and Through-Hole Assembly

The structure of the semiconductor materials has been changing over time and has become complex, therefore the packaging has also needed to be advanced with time. The compliment and handling of the complexity of the semiconductors, new types of integrated circuits have been developed and classified as different names and categories based on the mounting techniques.


The Through Hole Mounting Technique

The through hole mounting technique is involving different types of components which are involving the use of wires and are being mounted over the holes in the circuit boards. This is why the name of through hole mounting is given to the technique. The leads are relying over the holes in the multilayered PCBs and these leads are then soldered for the permanent mounting. This technology is being used in the dual inline packaging and pin array grid packaging etc.

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The Surface Mounting Technique

The surface mounting technique is a new one and is based on complex integrated circuits. The technique of surface mounting has increased number of pins in the integrated circuits, having smaller size and light weight. The Components are directly mounted over the surface of the printed circuit board rather than mounting over holes. The technique is being used in the chip carrier packaging etc.


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There are numerous reasons why the surface mounted technology known as SMT is better than that of the through hole technology. The WellPCB is offering both SMT and through hole assembly circuit boards. The best advantage of the SMT circuit boards is that these have reduced the size of the circuits and can integrate more and more components over it. One of the other advantages is that the SMT based circuits boards have less number of technical failures and having long life as compared to the through hole assembly circuits.