Flexible PCB Capability

Manufacturing Capability:Conventional Capability;
Ultimate Capability:Unconventional ability;Submit to review beyond these Capabilities.

 

Category

Project Item

Normal Capability

Ultimate Capability

  FPC Base Material(Adhesive)

ShengyiSF302:PI=0.5mil,1mil,2mil;Cu=0.5oz,1oz

 

ShengyiSF305:PI=0.5mil,1mil,2mil;Cu=0.33oz,0.5oz,1oz

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Material FPC Base Material(Adhesiveless)

SongxiaRF-775/777:PI=1mil,2mil,3mil;Cu=0.5oz,1oz

 

Xinyang:PI=1mil,2mil;Cu=0.33oz,0.5oz,1oz

 

Taihong PI=1mil,2mil;Cu=0.33oz,0.5oz,1oz

 

Dubang AP:PI=1mil,2mil,3mil,4mil;Cu=0.5oz,1oz

PI=1mil,2mil,3mil;Cu=2oz

 

 

 

 

 

 

 

PI=1mil,2mil,3mil,4mil;Cu=2oz

  Layer 1-4 Layers

5-8 Layers

  Thickness of Finished Product (Flex part,no stiffener)

0.05-0.5mm

0.5-0.8mm

  Size of Finished Products(Min) 5mm*10mm(Bridgeless);10mm*10mm(Bridge) 4mm*8mm(Bridgeless);8mm*8mm(Bridge)
  Size of Finished Products(Max) 9inch*14inch 9inch*23inch(PI≥1mil)
Others Impedance Tolerance Single-Ended:±5Ω(≤50Ω),±10%(>50Ω) Single-Ended:±3Ω(≤50Ω),±8%(>50Ω)
  Impedance Tolerance Differencial:±5Ω(≤50Ω),±10%(>50Ω) Differencial:±4Ω(≤50Ω),±8%(>50Ω)
  Tolerance of Finger Width ±0.1mm ±0.05mm
  Min Distance to the Edge of Finger 8mil 6mil
  Min Distance between Pads 4mil 3mil
  Minimum Laser Hole 0.1mm /
Mechanical Minimum PTH 0.3mm /
  Min NPTH Tolerance ±2mil(Ultimate+0,-2mil or +2mil,-0) /
  Solder Bridge Min Width(bottom copper<2OZ) 4mil(Green),8mil /
Solder Mask Solder Bridge Min Width(bottom copper2-4OZ) 6mil,8mil /
  Overlay Colour White、Yellow(printed character:White) /
Surface Treatment

Type of Surface Treatment

 

 

 

Selective Surface Treatment

OSP   HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP

 

ENIG+OSP,ENIG+G/F

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 * Products Dislay Rigid-Flex Boards