Flexible PCB Capability

Manufacturing Capability:Conventional Capability;
Ultimate Capability:Unconventional ability;Submit to review beyond these Capabilities.

 

Project Item

Normal Capability     

FPC Base Material(Adhesive)

ShengyiSF302:PI=0.5 mil,1 mil,2 mil;Cu=0.5 oz,1 oz

          

ShengyiSF305:PI=0.5 mil,1 mil,2 mil;Cu=0.33 oz,0.5 oz,1 oz

FPC Base Material

Adhesiveless)

SongxiaRF-775/777:PI=1 mil,2 mil,3 mil;Cu=0.5 oz, 1 oz

(Ultimate:PI=1 mil,2 mil,3 mil;Cu=2 oz)

 

Xinyang:PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz

 

Taihong PI=1 mil, 2 mil;Cu=0.33 oz, 0.5 oz, 1 oz    

    

Dubang AP:PI=1 mil, 2 mil, 3 mil, 4 mil;Cu=0.5 oz, 1 oz

(Ultimate:PI=1 mil,2 mil,3 mil,4 mil;Cu=2 oz)

 

Layer

1-4 Layers (Ultimate:5-8 Layers)

Thickness of Finished Product(Flex part,no stiffener)

0.05-0.5 mm (Ultimate:0.5-0.8 mm)

Size of Finished Products(Min)

5 mm*10 mm(Bridgeless);10 mm*10 mm(Bridge)

Ultimate:4 mm*8 mm(Bridgeless);8 mm*8 mm(Bridge)

Size of Finished Products(Max)

9 inch*14 inch

Ultimate:9 inch*23 inch(PI≥1 mil)

Impedance Tolerance

Single-Ended:±5Ω(≤50Ω),±10%(>50Ω)

Ultimate:Single-Ended:±3Ω(≤50Ω),±8%(>50Ω)

Impedance Tolerance

Differencial:±5Ω(≤50Ω),±10%(>50Ω)

Ultimate:Differencial:±4Ω(≤50Ω),±8%(>50Ω)

Tolerance of Finger Width

±0.1 mm  (Ultimate:±0.05 mm)

Min Distance to the Edge of Finger

8 mil (Ultimate:6 mil)

Min Distance between Pads

4 mil (Ultimate:3 mil)

Minimum Laser Hole

0.1mm

Minimum PTH

0.3mm

Min NPTH Tolerance

±2 mil(Ultimate +0,-2 mil or +2 mil,-0)

Solder Bridge Min Width(bottom copper<2OZ)

4 mil(Green),8 mil

Solder Bridge Min Width(bottom copper 2-4OZ)

6 mil,8 mil

Overlay Colour

White、Yellow(printed character:White)

Type of Surface Treatment

 

 

Selective Surface Treatment

OSP HASL, Lead free HASL, Immersion gold, Hard gold, Immersion silver, OSP

 

ENIG+OSP,ENIG+G/F

 

* Products Dislay Rigid-Flex Boards

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