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What Is Popular Copper Laminates(Latest)

What Is Popular Copper Laminates(Latest)

Abstract

Copper laminates are very frequently used clads (of copper spread) over the resin composite materials for the PCB manufacturing industry. The copper is a good conductor.It is a composite insulator material which is hard and stiff. This is also called a base material for PCBs manufacturing. The base material can be either a rigid or flexible in nature. The very fundamental purpose of a copper laminate in an electronics product.It is used to mechanically support the pins i.e. Provide the firm base to hold the electronic components and electrically join them at the same time.

 

Content

1. Polyimide

2. FR-4

3. Phenolic

4. Arlon

 

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Fig. 1:- PCB laminated basic structure

 

Following are the popular copper laminate types used for PCB manufacturing:

 

1. Polyimide

 

It is used for high-temperature PCB applications.Also it provides more rework cycles for soldering and desoldering of components. It's Tg, glass transition temperature is 220°C so provides very good performance over high temperatures.

 

2. FR-4

 

FR-4 is a fiberglass resin based base material. It is a strong, fire retardant, hard to cut and hard to bend material. It’s Tg is around 160°C.

There are various versions of the FR-4 material. It is used in single, double and multilayer PCBs of digital, analog, mixed-signal and power supply applications.

 

3. Phenolic

 

This base material is used in low-cost applications available with the FR-2, CEM-1 or CEM-3 brand names. It is most widely used in single layer PCB of small household gadgets and appliances.

 

It is slightly brittle but hard to bend.

 

4. Arlon

 

It has different variants and their typical applications do starts beyond the application of FR-4 materials. It is a base material as well as the material for the multilayer PCBs. Their major applications are military, wireless, semiconductor test and communications systems.

 

Other Copper Laminates used are Tetrafunctional epoxy, Thermount and cyanate ester etc.

 

For electrically interconnecting the components the laminates can be made of nickel, stainless steel, aluminum and copper. However, the most widely used material for lamination purposes is copper. The aluminum found commercial applications recently and is appreciated in low-cost home appliances.

 

The conductive cladding layer is very thin and is over one or both sides of the resin composite material. The thickness of the cladding material is determined that how much material is deposited in terms of weight.

 

Common weights of the copper layer are 3/8, 1/2, 1 and 2 ounces per square inches the thicknesses are 12, 18, 35 and 70µm respectively.

 

 

 

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Fig. 2:- PCB copper clad sheet

 

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Fig. 3:- Multilayer PCB manufacturing using rigid-flex boards

 

For multilayer PCBs, the multiple different layers are manufactured and then stacked as per design. The two conduct layers are separated by prepreg materials and then pressed.To make them stiff and stick together, under specified controlled temperature and pressure.

Flickr photos from the group WELLPCB Project