PCB Capability

Manufacturing Capabilities
Material:    FR4, High TG FR4,Halogen Free material,CEM-3, Rogers HF material, etc.
Layer counts: 1-36 layers
Finished Copper Thickness: 0.5-5 OZ
Finished Board Thickness: 0.2-6.0mm
Min. Line/Track Width: 4mil
Min. Line/Track Space: 4mil
Min. Contour Tolerance: +/-0.1mm
Min. Finished Diameter of PTH Hole:   0.1mm
Max. Board Thickness/Hole Ratio: 12:1
Min. Solder Mask Bridge: 4mil (Min. SMT Pad Space 8mil)
Min. Legend(Silkscreen) Track Width:  5mil
Min. Legend(Silkscreen) Height: 30mil
Min. Drilling Slot Size: 0.6mm
Solder Mask Color: green, black, blue, white, yellow, and matt, etc.
Solder Mask Hardness: 6H
Legend/Silkscreen Color:          white, yellow, black, etc.
Surface Treatment: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc.
Other Technology:

Gold finger, peelable mask, Non-across blindried vias, characteristic impedance

control, Rigid-flex board etc.

Reliability Test:

Flying probe test/fixture test, impedance test, solderability test, thermal shock test,

hole resistance test,and micor metallographic section analysis, etc.

Wrap and Twist: ≤0.7%
Flammability: 94V-0
  • • High layers PCB manufacturing, up to 28 layers
  • • High Quality, Fixed delivery time
  • • FR4,High TG FR4, High-frequency Material, Metal based PCB...
  • • Fast service, Minimum lead time for bare PCB is only 2 days
  • • Prompt reply, quotation will be provided in 8 working hours!