High-Frequency, Low-Loss
PTFE PCB Assembly Solutions

We assemble PTFE PCBs fabricated from industry-recognized laminates sourced through our partner network. Materials include Rogers RO3003, RO4350B, and RO5880, which were selected for their stable dielectric values between 2.17 and 3.48 and loss tangents ranging from 0.0009 to 0.0037 at 10 GHz. 

We also work with materials from Taconic, Isola, and Arlon. This allows flexibility in meeting design specifications for various high-frequency applications and performance thresholds.

For assemblies requiring post-fabrication drilling or via rework, our processes operate at spindle speeds between 180,000 and 250,000 RPM with feed rates of 20 to 60 micrometers per revolution.

Specialized drill geometries reduce mechanical stress and prevent edge deformation. Plasma surface conditioning using argon-based treatments improves copper adhesion inside hole walls, reducing the potential for separation or via failure during reflow or field operation.

When assembling stacked or multilayer builds, we coordinate with fabrication partners to verify lamination quality. Press cycles are confirmed with temperature ranges between 260°C and 290°C and pressures from 200 to 400 psi, depending on the stack-up and resin system.

Where appropriate, we specify glass-reinforced prepregs to minimize vertical expansion and maintain mechanical alignment during assembly.

Copper feature accuracy is validated before assembly, with strict control over trace geometries to maintain impedance consistency. Etch process records confirm copper thickness tolerances within ±5% of design values, supporting signal integrity for RF and microwave circuits.

Our assembly lines use nitrogen-purged reflow ovens to limit oxidation and improve solder wetting. This method enables lower peak soldering temperatures and reduces void formation.

Plasma-treated surfaces further enhance joint reliability. We monitor solder joint integrity throughout the assembly process to prevent defects affecting high-speed or high-frequency circuits.

Completed assemblies undergo automated optical inspection (AOI) and X-ray evaluation. Electrical tests verify continuity and isolation. Where required, impedance testing, including time-domain reflectometry (TDR), is used to confirm transmission line consistency at frequencies up to 77 GHz, meeting RF performance specifications.

For builds requiring microvias or complex interconnects, we coordinate laser drilling using CO₂ or UV systems with controlled pulse energy settings. Laser parameters are selected based on laminate filler content and reinforcement to produce clean, precise vias without damaging the surrounding material.

All assembly operations comply with ISO 9001, IPC-A-610 Class 3, and RoHS directives. Assemblies designed for automotive, aerospace, or defense applications follow additional industry standards specified by customer requirements.