Telecom PCB Assembly Services

WellPCB’s high frequency telecom assemblies achieve an insertion loss of <0.5 dB/inch at 28 GHz. We use Rogers RO4350B (Dk=3.48 ±0.05, Df=0.0037) and Taconic TLY-5A substrates.

The power amplifier chain gain flatness is held within ±0.3 dB across operational bandwidth. This ensures long-term signal integrity.

We maintain ±15 μm component placement tolerances to ensure as close to a perfect fit as possible. Ground via stitching patterns keep the spacing under λ/10 with via diameters of 0.15 mm (at a minimum).

We manufacture single-ended 50Ω traces to ±5% tolerance using 1 oz copper on FR-4 with Er=4.2 (±0.1) at 1 GHz.

Our team builds differential 100Ω pairs to ±7% impedance control with 0.1 mm minimum coupling gaps and length matching within 0.1 mm over 50 mm trace runs.

Via backdrilling removes stubs up to 0.5mm deep, keeping the quality and reliability above 10 GHz.

Edge-coupled microstrip designs meet 0.075 mm minimum width and spacing. These precise measurements are a must for PCB assembly solutions in telecommunications equipment.

Our team fabricates microvia diameters to 0.1 mm finished size with a 1:1 aspect ratio through 0.1 mm dielectric layers. We also offer the option for stacked microvias, which allows up to four via-on-via builds with ±25 μm positional accuracy between layers.

Via-in-pad processes support 0.4mm pitch BGAs (with copper fill protrusion under 10 μm after planarization). Buried via designs connect layer pairs 2 to 11 with capture pad diameters of at least 0.15 mm. WellPCB’s any-layer HDI constructions extend to 12 layers.

Our SMT lines achieve a placement accuracy of ±30 micrometres for 0201 passive components (0.6 mm by 0.3 mm).

We assemble ball grid arrays with a 0.35 mm pitch to withstand more than 1,000 thermal cycles from minus 40°C to plus 125°C.

We use a stencil printing process that maintains a 75% area ratio for 0.35 mm pitch apertures. Reflow profiles peak at 245°C (±5°C) with 60 to 90 seconds above the solder alloy liquidus temperature.

We integrate SMT and through-hole processes. Within these processes, we use selective wave soldering in nitrogen, keeping void content under 5% in solder joints.

Our team maintains wave solder parameters at 260°C (±5°C) contact temperature with a 3 to 4 second dwell.

Conformal coating thickness stays between 25 and 75 μm using acrylic, silicone or urethane formulations. Coverage exceeds 95% with a masking accuracy of ±0.1 mm for connectors and test points.

Through-hole insertion maintains a clinch length of at least 0.8 mm, verified by automated optical inspection, supporting assembly services for telecom and environmental conditions often found in telecom networks.

Rigid-flex assemblies combine 25-micrometer polyimide flex with FR-4 rigid sections.

These transitions maintain single-ended impedance within ±3 ohms (for targets at or below 50 ohms) and ±5% for targets above 50 ohms.

We rate dynamic flex designs for more than 100,000 bend cycles on four-layer builds. Stiffener bonding uses 50 micrometer PSA with peel strength over 2 N/mm.

WellPCB’s flex placement achieves ±50 micrometer accuracy with vacuum tooling on 0.1 mm substrates. This enables miniaturization of electronic devices and custom builds in telecommunication PCBs.

We manufacture heavy copper PCB power layers with finished copper thicknesses up to 20 oz, enabling high current and thermal-load telecom PCB assembly. These builds support reliable power distribution.

WellPCB’s heavy copper fabrication process maintains layer adhesion during multi stage lamination. This makes sure the PCB remains durable in common telecom networks environments.

Reinforced plated vias increase the current handling, and copper pours with large thermal pads improve the heat spreading in high-power RF and amplifier circuits.

Each heavy copper design undergoes a PCB DFM review early on. This step helps to optimize conductor geometry, spacing, and thermal management.

WellPCB conducts vector network analyzer testing from DC to 50 GHz with reference planes calibrated to ≤0.1 dB magnitude and ≤2° phase uncertainty.

Time-domain reflectometry identifies impedance deviations over ±5Ω with 10 ps resolution. We also run functional RF tests to confirm that gain, noise figure, and P1dB compression points meet customer specifications.

Boundary scan testing covers more than 95% of digital circuits. We use IEEE 1149.1 JTAG vectors to validate dependable operation in the telecommunications industry.