Metal PCB Manufacturer & Supplier

We offer copper, aluminium, copper-aluminium composite, stainless steel, and iron as metal core PCB materials, each selected based on thermal conductivity, mechanical strength, and chemical compatibility.

Aluminum is used in ~85% of MCPCB builds due to its conductivity range of 1.0 to 2.2 W/m·K and low density (2.7 g/cm³), making it ideal for metal core PCB LED and general-purpose thermal designs.

Copper cores offer conductivity up to 4.0 W/m·K with higher tensile strength (210 MPa+) and are deployed in high-power PCBs, such as inverter modules and EV subsystems.

Steel and iron cores are selected where increased rigidity and resistance to deformation under load are needed, such as in vibration-exposed assemblies.

We fabricate single-layer, double-layer, and multilayer metal core PCBs using dielectric bonding and press lamination.

Single-sided MCPCBs consist of a copper trace layer, a thermally conductive dielectric, and a solid metal core optimized for vertical heat evacuation.

Double-sided builds use high thermal conductivity dielectric (≥2 W/m·K) on both sides of the metal substrate, allowing plated through-hole (PTH) connectivity for top/bottom side SMD assembly.

Multilayer MCPCBs use stacked copper and dielectric layers over the core, with blind/buried vias, ground/power planes, and isolation barriers, supporting high-frequency PCBs and high-density RF modules.

We offer metal core thicknesses from 0.4 to 3.2mm, depending on the required mechanical rigidity and heat transfer mass.

Copper foil thickness ranges from 0.33 oz (12 μm) to 10 oz (350 μm), supporting trace widths from 0.15 mm with aspect ratios up to 10:1. Dielectric materials are applied in 50 to 125 μm layers using filled or unfilled resin systems with thermal conductivity from 1.0 to 15 W/m·K.

Minimum line/space resolution is 3 mil/3 mil with ±10% trace width tolerance after etching.

Fabrication begins with DFM review and stack-up simulation, including thermal path modeling and expansion coefficient balancing.

Circuit imaging uses UV photoresist exposure in ISO Class 7 cleanrooms. Etching is performed with alkaline or acidic chemistries, depending on copper weight.

Mechanical or laser drilling enables via diameters down to 0.2 mm; for metal-backed PCBs, insulating collars are applied to prevent shorting.

ENIG, OSP, or HASL finishes are applied before full-panel AOI, flying probe, and impedance testing verify electrical performance.

We support industry-standard finishes including HASL (SnPb or lead-free), ENIG (Ni ≥120 μin, Au ≥2 μin), and OSP (ENTEK Plus HT).

Selective plating for high-wear pads and edge contacts is available on request. All finishes are RoHS compliant and conform to IPC-4552/4553 standards.

Surface treatments are selected based on final assembly method (e.g. reflow vs. wave soldering), component metallization, and storage duration.

Our engineering support includes metal core and dielectric material selection, via current analysis, and thermal modeling for localized hotspot mitigation.

We review all Gerber, BOM, and stack-up files for conformity with manufacturing tolerances and suggest DFM changes such as increasing annular rings, adjusting pad clearances for aluminum etching, and evaluating heat spreading efficiency.

Design rules are calibrated to IPC-2221 standards, with optional consultation for COB MCPCB design and direct thermal path optimization.

Every board undergoes 100% AOI, netlist-driven electrical testing, and visual inspection to IPC-A-610 Class 2 or 3.

For MCPCBs, we add X-ray inspection of insulated vias, microsection analysis of dielectric bond integrity, and impedance measurement on RF traces.

Boards with thermal vias are subjected to thermal shock cycling (-40 °C to +125 °C, 100 cycles) to evaluate solder joint reliability and expansion mismatch.