Reliable Power Bank PCB
Assembly Solutions

We manufacture power bank circuit boards with layer counts ranging from 1 to 50 layers, supporting both single-layer economical designs and complex multilayer architectures for high-performance modules.

Our material options include FR-4, high Tg FR-4, halogen-free laminates, CEM-3, polyimide, and aluminum substrates. The availability of polyimide and aluminum materials allows us to support designs requiring exceptional thermal performance or mechanical flexibility, including fast charging and high-capacity power banks.

Copper thickness options up to 1000 μm enable the creation of boards capable of handling significant current loads, essential for high-wattage outputs such as 65W, 100W, and multi-port fast charging applications. Our fabrication process supports fine trace and spacing geometries down to 1.8 mil, allowing for compact, high-density designs that incorporate complex circuit protection and control features without sacrificing board size or efficiency.

Surface finishes include leaded HASL, lead-free HASL, Immersion Gold (ENIG), OSP, Immersion Silver, and Hard Gold, ensuring reliable conductivity and durability under repeated use cycles.

Our assembly lines support surface mount technology (SMT) and through-hole assembly (THT), with the flexibility to perform single-sided, double-sided, or mixed technology builds.

We utilize high-precision placement equipment capable of handling component sizes down to 0.2 mm for BGAs and 0.15 mm/0.25 mm for QFP packages, achieving placement accuracies within ±30 μm. Our SMT lines achieve speeds up to 60,000 chips per hour, allowing for efficient production of prototypes and large production runs.

Quality assurance is a central part of our production process. All power bank PCBs undergo automated optical inspection (AOI) and X-ray evaluation to verify solder joint integrity and component placement.

Electrical testing—including flying probe and impedance testing—is applied to confirm signal continuity, isolation, and controlled impedance where required. Reliability testing covers critical areas such as solderability, thermal shock resistance, and hole wall integrity, ensuring that every board meets industry performance expectations.

Our processes and quality standards comply with ISO 9001:2015, ISO 14001:2015, IPC-A-610H Class 3, and RoHS directives. We are also UL certified, supporting product safety and regulatory compliance in global markets.

We offer flexible production schedules, with standard lead times of 5 to 6 days and expedited services capable of delivering fully assembled boards in as little as 24 to 48 hours.

Our capacity ranges from single prototypes (as low as one piece) to high-volume manufacturing, providing scalability to match the needs of startups, established manufacturers, and custom product developers.

Our power bank PCBs integrate industry-standard ICs and advanced protection systems. Charging controllers like the TP4056 manage constant current/constant voltage (CC/CV) charging with automatic termination.

Protection ICs such as the DW01-P, often paired with dual MOSFETs (e.g., FS8205A), provide overcharge (4.25V ±50mV), over-discharge (2.4V ±0.1V), and overcurrent safeguards.

Boost converters such as the XL6009 regulate voltage for outputs up to 20V or higher. At the same time, system-on-chip solutions like the IP5358 and IP5328P enable smart energy distribution, multiple fast-charging protocols, and load balancing across multiple USB outputs.