- BGA, abbreviated as ball grid array, is an SMT package type made for integrated circuits.
- BGAs have more interconnection pins than regular chip carriers—placed on a flat package or dual in-line.
- All BGA devices adopt specific soldering control. And automated processes are responsible.
Definition of BGA
BGA, abbreviated as ball grid array, is an SMT package type made for integrated circuits. They also create a lasting mounting for devices like microprocessors.
BGAs have more interconnection pins than regular chip carriers—placed on a flat package or dual in-line. The entire base surface of BGAs is useful, unlike other devices that only use their perimeter.
All BGA devices adopt specific soldering control. And automated processes are responsible. Hence, you’ll find this process in tech-controlled automated reflow ovens.
The Merits and Demerits of BGA
The Applications of BGA
▶ Consumer Electronics
▶ Automotive Sector
▶ Flat Electronics Systems
▶ Integrated Circuits in TVs, computers, smartphones, etc.
How the BGA Assembly Works
The Method of Testing the BGA
Testing a BGA assembly board involves searching for a soldering fault. And it isn’t easy to achieve this without using specific equipment. Also, the process helps to ensure that your PCB performs well.
Some of the tools you can use include endoscopes, industrial CT scanning machines, X-ray machines, JTAG, etc.
How do these tools help?
They have a 2D and 3D vision, which helps you to detect problems easily. You can spot things like solder thieving, solder balls, missing solder balls, excess solder, paste bridging, etc.
Testing also helps you to confirm the correct placement of the solder balls. Plus, it ensures there’s no issue with each contact pad.
With that said, using X-ray images has its snags. For instance, it may be difficult to spot parts in the same location. Or you may even notice interference with the X-ray with background metals like POP parts.
Hence, it would help if you had caution when you align the BGA with the board. Furthermore, the testing tools help to supplement precise placement and offer a measure of quality assurance.
Inspection of BGA Assembly with X-Ray
Like we mentioned earlier, X-ray machines are effective tools that show different defects. And the faults may show up during the BGA assembly. In summary, the X-ray solves soldering problems.
We have an X-ray support software, which helps to calculate the solder ball’s gap size. Also, it ensures that the BGA assembly follows IPC standards (Class III or Class II)—depending on your specifications.
But that’s not all.
Our skilled technicians use 2d X-rays. Hence, it makes it easy to provide 3D images that confirm problems like cold solder joints in BGA balls, via in pad BGA designs, and inner layers with buried or blind vias.
Capabilities of BGA Assembly
Our BGA assembly has automated placement systems (four). And they have Vision Systems that help to examine solder ball coverage.
An automated system with a 3D laser is also available. It helps inspect the automatic placement of the solder ball height of MBGA, CBGA, and PBGA. Plus, we confirm our BGA assemblies with a real-time X-ray system.
You can place your orders with a minimum size of 0.3mm. The minimum space between two BGA is 0.2mm. And the minimum distance to the circuit line is 0.2mm.
What if your specifications are higher?
Not to worry. All you need to do is state your specific requirements and leave the rest to us.
Why Are We The Leading BGA Manufacturer
One thing you can always count on is our vast experience in handling different types of BGAs. So, it doesn’t matter if you prefer complex components like DSBGA—we have got you covered.
In other words, you can trust us to produce high yield and high-quality BGA boards. Above all, we have state-of-the-art BGA placement equipment.
Plus, we offer highly customizable complete PCB assembly solutions and high-precision BGA assembly processes.
Get in touch with us today to get a free online quote.