Printed Circuit Board (PCB) Cleaning is as delicate as the process of making the board. Connections can be damaged, components loosened and materials compromised if the wrong cleaning method used. To avoid these, you need to take the same care in selecting the right cleaning method as you did when designing, specifying and producing the board.
There are a variety of contaminants that can accumulate on a PCB. Solving the problem with the correct corresponding method will be more effective and efficient.
Processing after Drilling:
Due to drilling,the circuit board will appear copper foil caused by drill during drilling.So the board must be processed after drilling.The way of processing is through the brush board machine
directly to wash out the circuit board of the oxide layer and the copper wire.This step is very important. If the oxide layer is not cleared out,it will greatly reduce the adhesion of soldermask when printing which will result in resistance to solder off.If the copper wire is not cleaned,either it may cause the copper wire to remain on the surface of the circuit board does not look good even more serious the silk screen will be pricked when printing.
The final treatment of the circuit board surface:
The final treatment of the circuit board surface depends on what is the handling of the circuit board pads.
If it is rosin treatment, the surface should be clean before treating the pads and then rolling the rosin on.
If it is spray tin treatment , it should be spray tin then make the surface cleaning.
If it is anti-oxidation treatment then the way as similar as rolling of rosin.
The final treatment of the circuit board is also very important, or the pads will leave a residue, resulting in poor welding.